XSA 6960
Product Family
Product
reactive-polyamide
Product Description
A low viscosity, high build solventless polyamide curing agent for epoxy resin, principally used in the formulation of high build solventless coatings such as flooring
compositions, adhesives, encapsulations, epoxy mortars and press tool compounds.
Applications
Technology
coating-resins
End Use
Electrical encapsulation, potting and floor screeds and self levelling floor paints
Availability
Worldwide
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